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    Dissipator® 319 is a room temperature curing, two component thermal conductive epoxy adhesive for potting applications. Dissipator® 319 offers low viscosity for potting applications, is recommended for encapsulation of components that require heat dissipation and thermal shock properties. Dissipator® 319 features good thermal conductivity (1.1 W/mK to 1.4 W/mK)
    SKU: 319PT
    Products specifications
    Substrates Glass
    Substrates Metal
    Substrates Composite
    Applications Thermally Conductive
    Product tags

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