Activators and accelerators are essential chemicals used with adhesives to initiate and speed up the curing process. Activators are catalytic agents that play a crucial role in the chemical curing process, while accelerators are typically used to achieve fast fixture times in high-speed manufacturing environments or to overcome substrate challenges, such as bonding materials with low surface energy. These chemicals can be applied using a brush or aerosol spray.
It's important to keep the activators and adhesives separate until curing is desired, as the curing process can begin quickly once they come into contact. One common method is to apply the activator or accelerator to one substrate and the adhesive to the other. When the parts are mated, the adhesive and chemical will naturally mix. In some cases, accelerators can be sprayed onto the part just before mating to speed up the curing process, after carefully applying the adhesive first.
However, there are trade-offs with using accelerators. Generally, the longer the curing time, the stronger the bond. Accelerators may cause adhesives to cure and harden before they have fully connected with the substrate, especially when working with porous materials that require more time to integrate the adhesive with the surface.
Accelerator 48 is a solvent-based accelerator for instant adhesives. The accelerator is designed to speed the cure of Hernon cyanoacrylate adhesives. Accelerator 48 is used where increased cure speed of Hernon® cyanoacrylate adhesives is required. Especially recommended for applications involving printed circuit board wire tacking and tamper proofing of adjustable components.
Accelerator 58 is a single component non-CFC solvent-based product, formulated to provide a faster cure on acidic surfaces and cure excess Instantbond? cyanoacrylate adhesive outside the bond line. Accelerator 58 is used to increase the cure speed of Hernon® Instantbond® Adhesives. It is especially suited for post application on exposed Instantbond® adhesive outside of the bond line. Loudspeaker assembly and bonding jewelry are two examples.
Activator 45 is solvent-free and designed to initiate the cure of Hernon® toughened acrylic adhesives. Since Activator 45 contains no solvents, no waiting time for solvent evaporation is needed prior to assembly.
Activator 47 is solvent-free and designed to initiate the cure of Hernon toughened acrylic adhesives. Since Activator 47 contains no solvents, no waiting time for solvent evaporation is needed prior to assembly.
Activator 51 is a solvent-free product that is designed to initiate the cure of Hernon® toughened acrylic adhesives. Since Activator 51 contains no solvents, no waiting time for solvent evaporation is needed prior to assembly.
Activator 56 is a single component, non-CFC solvent-based product, designed to promote the cure speed of Hernon® Structural Adhesive/Sealants. Activator 56 is used where increased cure speed of Hernon® anaerobic adhesives and sealants is required. Especially recommended for applications with passive metals, inert surfaces or where large gaps are present.
Adhesion Promoter 42 is a single component product designed to improve adhesion to low surface energy plastics such as polyethylene, polypropylene, and Santoprene to similar substrates using Quantum® and Instantbond® adhesives.
Hernon® HPS Initiator 91 is used to activate Hernon® Hernon Porosity Sealant (HPS) resins. Hernon® HPS Initiator 91 activates HPS 991R enabling the system to cure at elevated temperatures.
Primer 37824 is a single component, solvent-free, reactive monomer-based product designed to promote the cure speed of Hernon® anaerobic adhesives and sealants. Primer 37824 is used where increased cure speed of Hernon® anaerobic products is required, and for difficult to bond applications where galvanized steel or zinc electroplated surfaces are involved. This product was specially formulated for increasing bond integrity on dichromated surfaces.
Primer 46 is a single component, solvent-free, reactive monomer-based product designed to promote the cure speed of Hernon® anaerobic adhesives and sealants. Primer 46 is used where increased cure speed of Hernon® anaerobic adhesives and sealants is required. It is especially recommended for applications with passive metals or inert surfaces and with large bond gaps. It is particularly recommended for cure conditions below 15°C.
Primer 49 is a single component, non-CFC solvent based product designed to promote the cure speed of Hernon® anaerobic adhesives and sealants. Primer 49 is used where increased cure speed of Hernon® anaerobic adhesives and sealants is required. It is especially recommended for applications with passive metals or inert surfaces and with large bond gaps. It is particularly recommended for cure conditions below 15°C. Primer 49 meets the requirements of MIL-S-22473E (Grade T) and ASTM D5363 (Grade T).
Primer 50 is a single component, non-CFC solvent-based product designed to promote the cure speed of Hernon® anaerobic adhesives and sealants. Primer 50 is used where increased cure speed of Hernon® anaerobic adhesives and sealants is required. It is especially recommended for applications with passive metals or inert surfaces and with large bond gaps. It is particularly recommended for cure conditions below 15°C. Primer 50 meets the requirements of ASTM D5363 (Grade N) and MIL-S-46163A Grade F.
Primer 57 is a single component, solvent-free, reactive monomer-based product designed to promote the cure speed of Hernon® anaerobic adhesives and sealants. Primer 57 is used where increased cure speed of Hernon® anaerobic products is required, and for difficult to bond applications where galvanized steel or zinc electroplated surfaces are involved. This product was specially formulated for increasing bond integrity on dichromated surfaces.
Hernon® HPS Activator 4322 is used to activate Hernon® Hernon Porosity Sealant (HPS) resins. HPS resins cures to form a thermoset polymer when exposed to elevated temperature. Thermal content and coefficient of thermal transfer in the workpieces influence the cure rate of the HPS system. Higher temperatures produce quicker cure rates. HPS resins generally cures within the range of 177°F (80°C) to 205°F (96°C). Proper cure requires the workpiece to uniformly attain full cure temperature. Parts that do not transfer heat well will required longer processing times. Efficient thermal conductivity yields shorter processing cycles. Parts with heavier cross sections require longer exposure at heat to attain sufficient temperature internally. Carefully consider part geometry. Consult Hernon® Technical Service for specific process requirements.