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    Thermally Conductive

    Thermally conductive adhesives are often used to fill gaps between heat sinks and motherboards.Thermally Conductive Adhesives Specially Formulated for Efficient Heat Conduction

    Thermally Conductive Adhesives are often used to bond heat sinks or encapsulate sensors. They provide a fast bond that does not insulate heat in the way most other adhesives will. Manufacturers can select specific capabilities of thermal transfer with the coefficient of thermal conductivity or “K factor” maxing out at 0.808 for Dissipator® 745. More formulas are available with higher conductivity via the Hernon Manufacturing custom formula development program that designs new adhesives for specific manufacturing operations.

    While conducting heat, Hernon Manufacturing Dissipator® brand adhesives also insulate against electric currents- reducing the risk of shorting components or misrouting power. Thermally conductive adhesives are also used for potting components to ensure an even heat distribution and other applications including the fabrication of printed circuit boards, adhering LEDs, and bonding materials with different thermal expansion rates.

    Significant Features and Key Advantages of Hernon Manufacturing Thermally Conductive Adhesives:

    • Reduced cost and time per application over alternative fastening methods
    • Conduct heat through an adhesive bond
    • Diffuses stress across the entire bonded surface
    • Bonds using lightweight polymers
    • 100% Active – No Solvents
    • Resistant to Vibrations and Impacts
    • Insulates electrically
    • Seal and fills gaps
    • Strong thermal cycling tolerance
    • Apply across the entire bonding surface in one step
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    1 Gallon of Dissipator 319

    Dissipator® 319 is a room temperature curing, two component thermal conductive epoxy adhesive for potting applications. Dissipator® 319 offers low viscosity for potting applications, is recommended for encapsulation of components that require heat dissipation and thermal shock properties. Dissipator® 319 features good thermal conductivity (1.1 W/mK to 1.4 W/mK)


    Hernon Dissipator 745D is a thermally conductive room temperature cure adhesive that is designed for bonding electrical components to heat sink with a controlled gap.
    25ml bottle of Dissipator 745

    Dissipator® 745

    Dissipator® 745 is a thermally conductive room temperature cure adhesive that is designed for bonding electrical components to heat sink with a controlled gap. Dissipator® 745, through a special shimming property, insulates the component electrically while allowing thermal conductivity. This special shimming feature produces a constant gap of 0.005 in. to 0.006 in. between components.
    25ml bottle of Dissipator 746

    Dissipator® 746

    Dissipator® 746 is a thermally conductive adhesive formulated for bonding electrical components to heat sinks or printed circuit boards. Fast room temperature cure combined with excellent heat dissipation for thermally sensitive components and controlled strength for service repair provide perfect replacement for tapes, epoxies, silicones, fasteners and mechanical clips. Typical applications include bonding transformers, transistors and other heat generating electronic components to printed circuit board assemblies or heat sinks.