Potting Epoxies

Electronics are protected against water and alteration with a layer of hard clear epoxy potted in place. The barcode can be read through the epoxy layer.

Protecting Electronics with Precision and Durability

Hernon Manufacturing offers high-performance potting epoxies designed to protect sensitive electronics from water, alterations, and environmental damage. By using potting epoxies, electronic components are sealed with a layer of hard, clear epoxy that ensures protection while maintaining functionality—such as barcode readability through the epoxy layer.

Our potting epoxies, along with silicones and polyurethanes, are ideal for potting and encapsulation applications. The high chemical, impact, and temperature resistance of our potting epoxies makes them perfect for safeguarding electronics in various environments. Hernon’s potting materials start as low-viscosity, self-leveling liquids that quickly fill gaps in and around components, curing into either rigid, opaque compounds or clear, flexible compounds, depending on the specific requirements.

All potting epoxies from Hernon are 100% solid systems with no solvents. Our materials can be cured using heat via Hernon’s UV LED curing lights or anaerobically with low exotherm formulas. We also offer custom potting epoxies tailored to match the thermal expansion rates of substrates and provide superior adhesion to a wide range of materials.

Significant Features and Key Advantages of Hernon Manufacturing Potting Epoxies:

Bonds to a wide variety of substrates
High impact, shock, and vibration resistance
100% Solid System with NO solvents
Custom formulas to match thermal expansion rates
Thermal cycling tolerance (temperature stable)
Environmental resistance, including waterproofing
Electrically insulating formulas available
Resists corrosion, tampering, and environmental elements
Clear, opaque, and color versions available
Scan barcodes through clear potting epoxies
Secure components against tampering and damage
Fast room temperature curing or low exotherm curing options

Popular Potting Epoxies:

Tuffbond® 321: Flexible, low-viscosity resin system for potting and encapsulating electrical components.
Tuffbond® 317: Two-component system with customizable rigidity for different applications.
Tuffbond® 316: Black version of Tuffbond® 317, ideal for protecting proprietary technologies.
Tuffbond® 302: Fast-curing modified epoxy with superior resistance to moisture, chemicals, and heat

Explore Hernon’s potting epoxies today for your next project and experience the unmatched protection and durability they offer.

View as Grid List

Sort by

Display per page

Silastomer® 343

Silastomer® 343 is a black, high performance, single component, ready to use adhesive / sealant. It has a paste-like consistency, which cures to a tough, resilient and durable silicone rubber when exposed to moisture in the air. Designed to provide excellent oil resistance and can be used as a form in place gasket. It will adhere to clean metals, glass, most types of wood, silicone resin, vulcanized silicone rubber, natural and synthetic fiber, ceramic, many plastics and painted surfaces. Silastomer® 343 provides excellent resistance to moisture, weathering, vibration, ozone and extreme temperatures. It can be applied in surface temperatures of 0°F to above 120°F with no loss in performance. Fully cured Silastomer® 343 can withstand extended periods at temperatures up to 400°F.

TUFFBOND 397

Hernon® Tuffbond® 397 is a single component, high temperature resistant, heat activated epoxy. It cures to a high-performance thermoset system with excellent adhesion properties to a wide variety of substrates. Tuffbond® 397 will change from amber-yellow to a reddish brown upon cure. Product Benefits • High temperature resistance. • Single component (no mixing, no pot life). • Contains 150micron spacer beads for bond line control • Solventless. • Cures on demand (heat cure). • Will not slip during cure. • Changes color upon cure (yellow to brown). • Excellent adhesion to various substrates. • Gives high shear. • Low water absorption.

Tuffbond® 302

Tuffbond® 302 is a modified epoxy adhesive that provides a very fast room temperature cure. Tuffbond® 302 exhibits very good moisture chemical and heat resistance. This very fast cure epoxy adhesive is specially formulated for rapid in-line assembly of loud speakers. Tuffbond® 302 is also recommended for bonding metals, wood, ceramics, etc., and can be used for potting and encapsulation of electrical and electronic components.

Tuffbond® 316

Tuffbond® 316 is a two component, room temperature cure system. By changing the ratio of resin and hardener, the cured adhesive can change from a tough and flexible to a hard and rigid system. Tuffbond® 316 is recommended for bonding metal, glass, wood, concrete, and rubber, and can be used for potting and encapsulation of electrical and electronic components.

Tuffbond® 317

Tuffbond® 317 is a two component, room temperature cure system. By changing the ratio of resin and hardener, the cured adhesive can change from a tough and flexible to a hard and rigid system. The resin offers a unique combination of hardness and flexibility with high chemical and solvent resistance. Tuffbond® 317 is recommended for bonding metal, glass, wood, concrete, and rubber, and can be used for potting and encapsulation of electrical and electronic components.

Tuffbond® 321

Tuffbond® 321 is a flexible, low viscosity, general purpose resin system used for casting, potting, and encapsulating of electrical and electronic components. This unique product has been formulated to combine ease in handling with optimum physical, thermal and electrical insulation properties.

Ultrabond® 721

Ultrabond® Sealant 721 is a UV curable adhesive that can be used to seal a variety of plastics when exposed to UV light. The sealant offers a water- tight seal with excellent environmental resistance. Prevents material escaping through a crimped seal. With Ultrabond® Sealant 721 a low powered UV lamp (Blacklight), can be used to inspect for the presence of adhesive on the substrates.