Quantum® 135

Activator 63 is a solvent-based product, specially formulated to promote the cure of Hernon Adhesives.

Tuffbond® 313 adhesive/sealant is a two component, 100% solid system, one to one ratio, room temperature cure system. Tuffbond® 313 is recommended for bonding metals, wood, ceramics, etc., and can be used for potting and encapsulation of electrical and electronic components.

Dissipator® 746 is a thermally conductive adhesive formulated for bonding electrical components to heat sinks or printed circuit boards. Fast room temperature cure combined with excellent heat dissipation for thermally sensitive components and controlled strength for service repair provide perfect replacement for tapes, epoxies, silicones, fasteners and mechanical clips. Typical applications include bonding transformers, transistors and other heat generating electronic components to printed circuit board assemblies or heat sinks.

SelfSealer® 616 is a high viscosity, tough, pre-applied, non-hardening threaded sealant. When dried, it becomes a resilient, tight clinging, non-curing sealant for tapered or straight threads. It provides an instant seal on different pipe threads and can be used up to eight (8) times without recoating. SelfSealer® 616 is water based, non-toxic, safe and can be applied easily without special handling precautions. It provides resistance to vibrational loosening because of its prevailing torque characteristics. Therefore, it is very effective on non-locking applications.