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    Tuffbond® 65891

    Tuffbond® 65891 is a two-component, room temperature cure system. Tuffbond® 65891 is recommended for bonding metal, glass, wood, concrete, and rubber, and can be used for potting and encapsulation of electrical and electronic components.
    SKU: 65891PT
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    Products specifications
    Substrates Wood
    Substrates Plastic
    Substrates Stone
    Substrates Metal
    Substrates Composite
    Applications Bonding
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